General

1. Composition and characteristics of Cerasolzer

2. Materials to be bonded with Cerasolzer

3. Bonding method

4. Adhesive strength

S. Adhesive mechanism

6. Applications of Cerasolzer

During many years of extensively studying the techniques of glass-metal bonding, Asahi Glass Co., Ltd. discovered that glass is amenable to direct soldering. After several years of research, its adhesive mechanism has been explained, leading to the development of a new solder: "Cerasolzer"Efforts are now being made to find more applications for Cerasolzer. In particular, this solder is used in the manufacturing of electrical parts, electrical materials and flat glass products because it provides a unique bonding technique that can take the place of commonly used silver baking, indium soldering, molybdenum-manganese, and resin bonding methods. Cerasolzer is becoming better known for its practical Merits.

example, upon application of this method to the molten Cerasolzer coated on a transparent glass plate, complete contact between Cerasolzer and the substrate is established to make the boundary zone look like the so-called "mirror surface".  Ultrasonic Cerasolzer bonding can be performed by three methods:

Cerasolzer is melted in a specific crucible which is equipped with an ultrasonic vibrator. While the molten Cerasolzer has a ripple on its surface caused by ultrasonic vibration, the specimen is dipped in. This method is of good use for whole surface coating with Cerasolzer.   What is most important in bonding with Cerasolzer is the surface cleanliness of the substrate - glass, ceramics, metal oxide, etc. Such cleanliness does significantly affect the bonding performance of Cerasolzer. In particular, staining with organic substrate, resin, finger-prints, flux for ordinary solder, acid, alkali, powder, carbon, etc., must absolutely be avoided. Since Cerasolzer has a number of uses, the adhesive strength of Cerasolzer must be measurcd by the application. Here, the adhesive strength is described for the lead bonding to soda glass or In203 - coated glass performed by the one-step method. Physical and chemical factors should be noted they particularly affect the bonding performance of Cerasolzer.

Since the adhesive property of Cerasolzer is essentially based upon the characteristics of the alloy, the ultrasonic vibration is applied to help its bonding process. Cerasolzer contains a small amount of such elements as Zn, Ti, Si, Al, Be and Rare Earth which have a strong chemical affinity with oxygen. These metals, during the bonding process, combine with oxygen in air to form oxide, which is chemically bound to the surface of the glass, ceramics, metal oxide, etc. Thus, Cerasolzer bonding process proceeds under the liquid-solid reaction between oxides themselves. Such adhesive mechanism has been already confirmed in other areas of glass-metal bonding such as vacuum tube sealing. If oxygen is completely eliminated by substituting the air surrounding the bonding equipment with an inactive gas (e.g. nitrogen)the adhesibility of Cerasolzer will be lost. It has been experimentally found that the critical oxygen concentration for adhesibility is about 2%. A model of chemical binding between Cerasolzer and the substrate R binding between Cerasoizer is illustrated in Figure below.

5. Applications of Ceresolzer

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